FEATURES
Bump Height (BH): 6, 6.5, 7, 7.5, 8.5nm
Ultra stable bumps: < ± 0.4 nm variance
Bump pitch = 16 µm
Pitch Stability: ± 1 µm
Dual spindle independent operation
In-line conveyor for loading/unloading
Clean-room class 10 standard
APPLICATIONS
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Sample
Magnified bumps after laser marking
Consistent bump height
Stable nm bump height
RP pitch stability
Proven patented technology with 100+ machine installations. Stable machine performance with continuous R&D support.
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R&D REPORT
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